Ruggedization
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Ruggedization


Ruggedization is designed into products from TEK Microsystems, Inc. from the start. Our product design and development process is a combination of design, test, and assembly practices to address the thermal and mechanical packaging requirements of both commercial and rugged environments.

Tekmicro products operate effectively in laboratory, rugged air-cooled, and rugged conduction-cooled environments to meet the needs of R&D and deployed applications.  

Commercial products are intended for use in application development and benign operating environments. Rugged Level 2, convection cooled, products are intended for harsh environments with more demanding temperature, humidity, shock, and vibration requirements. Rugged Level 3, conduction cooled, products provide wider operating temperatures and increased capabilities for shock, vibration, and humidity for extreme operating conditions.

All of Tekmicro’s commercial and rugged products share the same circuit design and layered drop-in software. This allows customers to develop their application on commercial products in the lab and then seamlessly transition to rugged environments once development has been completed.

This easy migration from commercial to rugged environments results in lower total development costs, reduced system integration risk, and quicker time to market.


Environmental Specifications
Commercial
Rugged Level 2
Convection Cooled
Rugged Level 3
Conduction Cooled
Operational Temperature  0°C to +55°C
(300 LFM airflow)
@ 0 to 10,000’		  -40 to +70ºC
(600 LFM airflow)
@ 0 to 30,000’		  -40°C to +85°C (Card Edge) @ 0 to 60,000’
 Storage Temperature @ Relative Humidity -40°C to +85°C
(10% to 95% non-condensing)		 -55°C to +100°C
(5% to 95% non-condensing)
 -55°C to +125°C
(0% to 95% non-condensing)
Relative Humidity (Operational)
 10% to 95%
(300 LFM airflow)
non-condensing
  5% to 95%
(600 LFM airflow) non-condensing
  0% to 95%
non-condensing
 Shock (Operational)
  20g, 11 1/2 ms sine pulse
 20g, 11 ms 1/2 sine pulse
 40g, 11 ms 1/2 sine pulse
 Vibration (Sine) (Operational)
  sine 2g peak
15 to 2000 Hz
  sine 10g peak
15 to 2000 Hz
  sine 10g peak
15 to 2000 Hz
 Vibration (Random) (Operational)
  0.003g2/Hz from 15 to 2000 Hz
  0.04g2/Hz from 15 to 2000 Hz
 0.1g2/Hz from 15 to 2000Hz per MIL-STD-810E Fig 514.4 - 8 "12g RMS
 Conformal Coating
 No Yes Yes
Board-Level Ruggedization

Individual products may vary in minor ways and references should be made to individual data sheets for specific details.

Tekmicro VXS and VME system solutionsSystem Level Ruggedization

Tekmicro has delivered systems and subsystem solutions to many customers with demanding levels of environmental specifications. From standard commercial platforms to ruggedized enclosures operating in harsh environments including conduction cooled packages, Tekmicro provides a complete development to deployment migration path.

Contact your Tekmicro representative to assess the specific needs of your project or program.
© 2008 Tek Microsystems, Inc. All rights reserved.