Ruggedization is designed into Tekmicro's military embedded systems from the start. Our design, test, and assembly practices address the thermal and mechanical packaging requirements of both commercial and rugged environments for our entire product line of real-time embedded systems, analog-to digital converters (ADC), digital-to-analog converters (DAC), and serial FPDP I/O modules.
Tekmicro's embedded boards and systems operate effectively in laboratory, rugged air-cooled, and rugged conduction-cooled environments to meet the needs of R&D and deployed applications.
Commercial grade embedded systems are intended for use in application development and benign operating environments. Rugged Level 2 , convection cooled, embedded systems are intended for harsh environments with more demanding temperature, humidity, shock, and vibration requirements. Rugged Level 3, conduction cooled, embedded systems provide wider operating temperatures and increased capabilities for shock, vibration, and humidity for extreme operating conditions.
All of Tekmicro’s commercial and rugged military embedded systems share the same circuit design and layered drop-in software. This allows customers to develop their application on commercial products in the lab and then seamlessly transition to rugged environments once development has been completed.
This easy migration from commercial to rugged environments results in lower total development costs, reduced system integration risk, and quicker time to market.
Environmental Specifications
Commercial
Rugged Level 2
Convection Cooled
Rugged Level 3
Conduction Cooled
Operational Temperature
0°C to +55°C
(300 LFM airflow)
@ 0 to 10,000’
-40 to +70ºC
(600 LFM airflow)
@ 0 to 30,000’
-40°C to +85°C (Card Edge) @ 0 to 60,000’
Storage Temperature @ Relative Humidity
-40°C to +85°C
(10% to 95% non-condensing)
-55°C to +100°C
(5% to 95% non-condensing)
-55°C to +125°C
(0% to 95% non-condensing)
Relative Humidity (Operational)
10% to 95%
(300 LFM airflow)
non-condensing
5% to 95%
(600 LFM airflow) non-condensing
0% to 95%
non-condensing
Shock (Operational)
20g, 11 1/2 ms sine pulse
20g, 11 ms 1/2 sine pulse
40g, 11 ms 1/2 sine pulse
Vibration (Sine) (Operational)
sine 2g peak
15 to 2000 Hz
sine 10g peak
15 to 2000 Hz
sine 10g peak
15 to 2000 Hz
Vibration (Random) (Operational)
0.003g2/Hz from 15 to 2000 Hz
0.04g2/Hz from 15 to 2000 Hz
0.1g2/Hz from 15 to 2000Hz per MIL-STD-810E Fig 514.4 - 8 "12g RMS
Conformal Coating
No
Yes
Yes
Board-Level Ruggedization
Individual products may vary in minor ways and references should be made to individual data sheets for specific details.
System Level Ruggedization
Tekmicro has delivered systems and subsystem solutions to many customers with demanding levels of environmental specifications. From standard commercial platforms to ruggedized enclosures operating in harsh environments including conduction cooled packages, Tekmicro provides a complete development to deployment migration path.
Complete the form below to have a representative assess the specific needs of your project or program.
Download the Ruggedization Data Sheet 
System Level Ruggedization 
